Via for semiconductor device and method

Assignee

• TSMC

Inventors

• Chia-Pang Kuo (16 patents)
• Chih-Yi Chang (14 patents)
• Ming-Hsiao Hsieh (7 patents)
• Wei Hsiang Chan (3 patents)
• Ya-Lien Lee (47 patents)
• Chien-Chung Huang (90 patents)
• Chun-Chieh Lin (113 patents)
• Hung-Wen Su (94 patents)

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