Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Backside contact for thermal displacement in a multi-wafer stacked integrated circuit

Backside contact for thermal displacement in a multi-wafer stacked integrated circuit

US Patent 12300669 · Granted May 13, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked structure for CMOS image sensors2025
Crank apparatus equipped with labor-saving mechanism and bicycle crank assembly2025
Metal-insulator-metal device with improved performance2025
Metal-insulator-metal device with improved performance2025
Hybrid bonding technology for stacking integrated circuits2025
Hybrid bonding technology for stacking integrated circuits2025
Semiconductor structure and manufacturing method thereof2025
Semiconductor structure and manufacturing method thereof2025
Semiconductor wafer seal ring having protrusion extending into trench in semicon2025
Semiconductor device including image sensor and method of forming the same2025
Semiconductor device including image sensor and method of forming the same2025
Shield structure for backside through substrate vias (TSVs)2025