Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Shield structure for backside through substrate vias (TSVs)

Shield structure for backside through substrate vias (TSVs)

US Patent 12230554 · Granted Feb 18, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including germanium region disposed in semiconductor substr2025
Image sensor having an improved structure for small pixel designs2025
Stacked structure for CMOS image sensors2025
Stacked structure for CMOS image sensors2025
Stacked integrated circuits with redistribution lines2025
3DIC interconnect apparatus and method2025
Crank apparatus equipped with labor-saving mechanism and bicycle crank assembly2025
Control chip and control method thereof2025
Multi-wafer integration2025
Device over photodetector pixel sensor2025
Hybrid bonding with uniform pattern density2025
High-speed readout image sensor2025