Through-silicon via in integrated circuit packaging

Assignee

• TSMC

Inventors

• Fong-Yuan Chang (135 patents)
• Chin-Chou Liu (87 patents)
• Chin-Her Chien (24 patents)
• Cheng-Hung Yeh (19 patents)
• Po-Hsiang Huang (130 patents)
• Sen-Bor Jan (46 patents)
• Yi-Kan Cheng (120 patents)
• Hsiu-Chuan Shu (4 patents)

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