Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12223252 | Through-silicon via in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2025-02-11 |
| 11586797 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2023-02-21 |
| 10949597 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2021-03-16 |
| 7531438 | Method of fabricating a recess channel transistor | Jih-Wen Chou, Chih-Hsun Chu | 2009-05-12 |