Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device, circuit board structure and manufacturing method thereof

Semiconductor device, circuit board structure and manufacturing method thereof

US Patent 12205923 · Granted Jan 21, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package and manufacturing method of the same2025
Package structure with conductive patterns in a redistribution layer2025
Method for forming mark, packaging method of semiconductor device, and semicondu2025
Method for forming mark, packaging method of semiconductor device, and semicondu2025
Semiconductor package and manufacturing method thereof2025
Conductive traces in semiconductor devices and methods of forming same2025
Photonic integrated circuit and package structure2025
Staggered metal mesh on backside of device die and method forming same2025
Structure having thermal dissipation structure therein and manufacturing method 2025
Package structure2025
Package structure2025
Thermo-electric cooler for dissipating heat of optical engine2025