Vacuum wafer chuck for manufacturing semiconductor devices

Assignee

• TSMC

Inventors

• Chien-Fa Lee (22 patents)
• Chin-Lin CHOU (2 patents)
• Shang-Ying Tsai (91 patents)
• Shou-Wen Kuo (46 patents)
• Kuei-Sung Chang (87 patents)
• Jiun-Rong Pai (112 patents)
• Hsu-Shui Liu (76 patents)
• Chun-Wen Cheng (244 patents)

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