Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

US Patent 12125793 · Granted Oct 22, 2024

Estimated economic value: $18,859,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Photonic interconnect and components in glass2025
Integrated optical coupler2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Glass substrates having transverse capacitors for use with semiconductor package2025
Solder interconnect hierarchy for heterogeneous electronic device packaging2025
Solder interconnect hierarchy for heterogeneous electronic device packaging2025
First layer interconnect first on carrier approach for EMIB patch2025
Position controlled waveguides and methods of manufacturing the same2025
Hybrid bonding technologies with thermal expansion compensation structures2025
Integrated MEMS resonator and method2025
Nested glass packaging architecture for hybrid electrical and optical communicat2025