Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package having warpage control and method of forming the same

Semiconductor device package having warpage control and method of forming the same

US Patent 11978729 · Granted May 7, 2024

Estimated economic value: $17,992,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of forming integrated circuit packages by bonding package component havin2025
Chip structure2025
Semiconductor die package with conductive line crack prevention design2025
Package substrate insulation opening design2025
Method for making a packaging substrate2025
Semiconductor device and manufacturing method thereof2025
Semiconductor device package having warpage control2025
Semiconductor device package having warpage control2025
Semiconductor device package having warpage control2025
Semiconductor device package having warpage control2025
Chip package with lid2025
Integrated circuit package and method of forming same2025