Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Via connection to a partially filled trench

Via connection to a partially filled trench

US Patent 11929258 · Granted Mar 12, 2024

Estimated economic value: $16,242,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of forming semiconductor device comprising conductive feature, dielectric2025
Interconnect structure including contact via over barrier layer2025
Interconnect structure with hybrid barrier layer2025
Semiconductor device having thermally conductive air gap structure and method fo2025
Interconnect structure and method for forming the same2025
Semiconductor interconnection structure and methods of forming the same2025
Methods for integrated circuit design and fabrication2025
Methods for integrated circuit design and fabrication2025
Semiconductor device having metallization layer with low capacitance and method 2025
Low-k dielectric and processes for forming same2025
Dual etch-stop layer structure2025
Tool mismatch reduction using aberration map of the tools2025