Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for routing local interconnect structure at same level as reference metal line

Method for routing local interconnect structure at same level as reference metal line

US Patent 11916077 · Granted Feb 27, 2024

Estimated economic value: $10,178,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit and method of forming the same2025
Semiconductor device and manufacturing method thereof2025
Weighing device with temperature sensing function and temperature compensation m2025
Semiconductor device and method of manufacturing the same2025
Semiconductor device2025
Integrated circuit having hybrid sheet structure2025
Semiconductor devices and methods of manufacturing thereof2025
Semiconductor devices and methods of manufacturing thereof2025
Semiconductor devices and methods of manufacturing thereof2025
Semiconductor devices and methods of manufacturing thereof2025
Methods for generating a circuit with high density routing layout2025
Methods for generating a circuit with high density routing layout2025