Solder material, solder paste, and solder joint

Assignee

• Senju Metal Industry Co.

Inventors

• Hiroyoshi Kawasaki (50 patents)
• Hiroki Sudo (12 patents)
• Takahiro Roppongi (24 patents)
• Hiroshi Okada (204 patents)
• Daisuke Soma (23 patents)
• Takashi Akagawa (8 patents)
• Hiroshi Takahashi (723 patents)
• Hiroshi Kawanago (2 patents)
• Satoshi Yokota (1 patents)
• Osamu Munekata (11 patents)

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