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Home › Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

US Patent 11333975 · Granted May 17, 2022

Estimated economic value: $6,899,000 ⓘ

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