Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package

Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package

US Patent 11328935 · Granted May 10, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fastening device for releasable connection to a perforated rail of an aircraft a2025
Power semiconductor device and method of producing a power semiconductor device2025
Method of manufacturing a semiconductor package, die, and die package2025
Method of manufacturing a semiconductor package, die, and die package2025
Semiconductor device2025
Method of manufacturing a package having an adhesion promoter2025
Interlayer of sub-structure having elevations and further sub-structure with fil2024
Chip package and method of forming a chip package2024
Chip package and method of forming a chip package2024
Chip package and method of forming a chip package2024
Chip package, method of forming a chip package and method of forming an electric2024
Methods for processing a wide band gap semiconductor wafer using a support layer2024