Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack

Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack

US Patent 11225712 · Granted Jan 18, 2022

Estimated economic value: $180,020,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for preventing line bending during metal fill process2025
Method for preventing line bending during metal fill process2025
Method for preventing line bending during metal fill process2025
Deposition of films using molybdenum precursors2025
Deposition of films using molybdenum precursors2025
Molybdenum fill2025
Vapor accumulator for corrosive gases with purging2025
Rare earth nanocrystal for highly efficient NIR to NIR wavelength conversions2024
System and method for mobile device phosphor excitation and detection2024
Apparatus and method for enhancing the safety of laser based systems2024
Tagging of fracking sand2024
Atomic layer deposition of metal films2024