Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Top via with hybrid metallization

Top via with hybrid metallization

US Patent 11139201 · Granted Oct 5, 2021

Estimated economic value: $5,888,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced capacitance between power via bar and gates2025
Reduced capacitance between power via bar and gates2025
Backside self aligned skip via2025
Backside self aligned skip via2025
Airgap spacer for power via2025
Airgap spacer for power via2025
Semiconductor passive device integration for silicon-on-insulator substrate2025
Self-forming barrier for use in air gap formation2025
Early backside first power delivery network2025
Early backside first power delivery network2025
Early backside first power delivery network2025
Power distribution network with backside power rail2025