Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip

Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip

US Patent 11114406 · Granted Sep 7, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of making high aspect ratio openings in a semiconductor device using ion 2025
Three-dimensional memory device including composite backside metal fill structur2025
Three-dimensional memory device and method of making thereof by non-conformal se2025
Three-dimensional memory device and method of making thereof by non-conformal se2025
Growth of thin oxide layer with silicon nitride and conversion2025
Three-dimensional memory device containing engineered charge storage elements an2025
Three-dimensional memory device including discrete charge storage elements and m2025
Three-dimensional memory device and method of making thereof using sacrificial m2025
Three-dimensional memory device and method of making thereof using sacrificial m2025
Method of making a three-dimensional memory device using composite hard masks fo2025
Method of making a three-dimensional memory device using composite hard masks fo2025
Three-dimensional memory device with intermetallic barrier liner and methods for2025