Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with multi-level conductive clip for top side cooling

Semiconductor package with multi-level conductive clip for top side cooling

US Patent 11075185 · Granted Jul 27, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package comprising a cavity with exposed contacts and a semiconduc2025
Power module with press-fit contacts2025
Stacked module arrangement2025
Power semiconductor device with dual heat dissipation structures2025
Solder stop feature for electronic devices2025
Semiconductor module with bond wire loop exposed from a molded body and method f2025
Power semiconductor package having first and second lead frames2025
Package with electrically insulated carrier and at least one step on encapsulant2024
Semiconductor package with releasable isolation layer protection2024
Power module with metal substrate2024
Linear spacer for spacing a carrier of a package2024
Power semiconductor device with dual heat dissipation structures2024