Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Face-to-face mounted IC dies with orthogonal top interconnect layers

Face-to-face mounted IC dies with orthogonal top interconnect layers

US Patent 10892252 · Granted Jan 12, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Embedded organic interposer for high bandwidth2025
Package-on-package assembly with wire bonds to encapsulation surface2025
Compressive sensing based image processing2025
Circuit for executing stateful neural network2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Protective elements for bonded structures2025
Circuitry for electrical redundancy in bonded structures2025
3D processor having stacked integrated circuit die2025
3D processor having stacked integrated circuit die2025
3D processor having stacked integrated circuit die2025
Neural network loss function that incorporates incorrect category probabilities2025
Seal for microelectronic assembly2025