Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Die stack arrangement comprising a die-attach-film tape and method for producing same

Die stack arrangement comprising a die-attach-film tape and method for producing same

US Patent 10861818 · Granted Dec 8, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer level method for manufacturing integrated infrared (IR) emitter elements h2022
Die stack arrangement comprising a die-attach-film tape and method for producing2022
Die stack arrangement comprising a die-attach-film tape and method for producing2022
MEMS-transducer and method for producing a MEMS-transducer2021
Method for producing packaged MEMS assemblies at the wafer level, and packaged M2020
MEMS sound transducer element and method for producing a MEMS sound transducer e2020
Method for producing packaged MEMS assemblies at the wafer level, and packaged M2020
Semiconductor package with a through port for sensor applications2020
Method for producing a MEMS sensor, and MEMS sensor2019
Camptothecin derivatives and uses thereof2019
Apparatus with a high heat capacity and method for producing the same2019
Electronic sensor device including a flip-chip mounted semiconductor chip and a 2018