Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly

Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly

US Patent 10584028 · Granted Mar 10, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor apparatuses with radio-frequency line elements, and associated man2025
Sensor device including sensor unit for a gaseous medium2025
Radiation source device2024
Radio-frequency devices and methods for producing radio-frequency devices2024
Package stacking using chip to wafer bonding2024
Sensor device including sensor unit for a gaseous medium2023
Integration of stress decoupling and particle filter on a single wafer or in com2022
Wafer level package structure with internal conductive layer2022
Wafer level method for manufacturing integrated infrared (IR) emitter elements h2022
Fastening device for a child's seat in a motor vehicle, and motor vehicle with s2022
Die stack arrangement comprising a die-attach-film tape and method for producing2022
Package stacking using chip to wafer bonding2022