Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formed

Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formed

US Patent 11402556 · Granted Aug 2, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power semiconductor device and method2025
IR emitter with glass lid2024
Apparatus having a functional structure delimited by a frame structure and metho2024
Power semiconductor device and method2023
Method and structure for sensors on glass2023
Die stack arrangement comprising a die-attach-film tape and method for producing2022
System and method for a transducer in an EWLB package2021
Apparatus having a functional structure delimited by a frame structure and metho2021
Method for producing a graphene-based sensor2021
Light emitter devices, photoacoustic gas sensors and methods for forming light e2021
Apparatus having a cavity structure and method for producing same2020
Die stack arrangement comprising a die-attach-film tape and method for producing2020