Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Test system and method of testing a wafer for integrated circuit devices

Test system and method of testing a wafer for integrated circuit devices

US Patent 10823759 · Granted Nov 3, 2020

Estimated economic value: $22,680,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micro device with adaptable thermal management device2024
Remote active cooling heat exchanger and antenna system with the same2022
Method and apparatus of package enabled ESD protection2021
Multiple insertion testing of test socket2020
Method of assigning contact elements associated with an integrated circuit devic2020
Method of assigning contact elements associated with an integrated circuit devic2020
Method of assigning contact elements associated with an integrated circuit devic2020
Method of assigning contact elements associated with an integrated circuit devic2020
Method of assigning contact elements associated with an integrated circuit devic2020
Chip package assembly with power management integrated circuit and integrated ci2020
Probe head securing mechanism for probe assembly2020
Probe head securing mechanism for probe assembly2020