Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Configuration and method of operation of an electrodeposition system for improved process stability and performance

Configuration and method of operation of an electrodeposition system for improved process stability and performance

US Patent 10745817 · Granted Aug 18, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Controlling plating electrolyte concentration on an electrochemical plating appa2025
Method of depositing silicon nitride films2025
In-situ sensor-fusion with artificial intelligence2025
Electrochemical deposition system including optical probes2024
Lipseals and contact elements for semiconductor electroplating apparatuses2024
Systems and methods for in-situ measurement of sheet resistance on substrates2024
Systems and methods for utilizing intrinsic current noise to measure interface i2024
Copper electrofill on non-copper liner layers2024
Electromagnetic interference reduction in extended reality environments2024
Controlling plating electrolyte concentration on an electrochemical plating appa2024
Conformal damage-free encapsulation of chalcogenide materials2023
Lipseals and contact elements for semiconductor electroplating apparatuses2022