Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method to enhance solder joint reliability

System and method to enhance solder joint reliability

US Patent 10636722 · Granted Apr 28, 2020

Estimated economic value: $4,794,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High density substrate routing in package2025
Semiconductor storage device including staggered semiconductor memory devices on2025
High density substrate routing in package2024
Protective enclosure for an electronic device2024
High density substrate routing in package2023
Semiconductor device package having cover portion with curved surface profile2023
Thermal relief for through-hole and surface mounting2022
System and method to enhance reliability in connection with arrangements includi2022
System and method to enhance reliability in connection with arrangements includi2022
System and method to enhance reliability in connection with arrangements includi2022
System and method to enhance reliability in connection with arrangements includi2022
System and method to enhance reliability in connection with arrangements includi2022