{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric", "item": "https://www.patentleaderboard.com/patent/10546835"}]}
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Home › Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric

Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric

US Patent 10546835 · Granted Jan 28, 2020

Estimated economic value: $38,246,000 ⓘ

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