Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Direct-bonded native interconnects and active base die

Direct-bonded native interconnects and active base die

US Patent 10522352 · Granted Dec 31, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Embedded organic interposer for high bandwidth2025
Circuit for executing stateful neural network2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Protective elements for bonded structures2025
Circuitry for electrical redundancy in bonded structures2025
3D processor having stacked integrated circuit die2025
3D processor having stacked integrated circuit die2025
Neural network loss function that incorporates incorrect category probabilities2025
Seal for microelectronic assembly2025
Weighted selection of inputs for training machine-trained network2025
Direct-bonded native interconnects and active base die2025
Direct-bonded native interconnects and active base die2025