Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Plasma etching systems and methods using empirical mode decomposition

Plasma etching systems and methods using empirical mode decomposition

US Patent 10504704 · Granted Dec 10, 2019

Estimated economic value: $109,358,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Large spot spectral sensing to control spatial setpoints2025
Methods and systems for sample analysis2025
Methods and systems for sample analysis2024
Integrated wafer bow measurements2024
Reflectometer to monitor substrate movement2023
Method of etch model calibration using optical scatterometry2023
Pulsed plasma chamber in dual chamber configuration2023
Multi zone gas injection upper electrode system2023
Method and apparatus for determining process rate2021
Method and apparatus for determining process rate2021
Method and apparatus for determining process rate2021
Method and apparatus for determining process rate2021