Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays

Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays

US Patent 10315918 · Granted Jun 11, 2019

Estimated economic value: $29,766,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing acoustic devices with improved performance2025
Mosaic focal plane array2025
Interface circuit for photodetectors providing full-frame integration and pixel-2025
Interface circuit for photodetectors providing full-frame integration and pixel-2024
Preventing epoxy bleed-out for biosensor devices2024
Method for manufacturing acoustic devices with improved performance2024
Bias circuit with improved noise performance2024
Imager with integrated asynchronous laser pulse detection having a signal compon2023
Digital pixel having high sensitivity and dynamic range2022
WLP BAW device with through-WLP vias2021
Fluidic sensor device having UV-blocking cover2020
BAW devices having top electrode leads with reduced reflectance2020