Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

US Patent 10269747 · Granted Apr 23, 2019

Estimated economic value: $918,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure, stacked structure with terminal comprising capping laye2025
Fabricating a sensing component encapsulated by an encapsulation layer with roug2025
Integrated circuit package and method2025
Semiconductor packages and method of manufacturing the same2025
Dense redistribution layers in semiconductor packages and methods of forming the2025
Package structure including a die having a taper-shaped die connector2025
Semiconductor package2025
Semiconductor device2025
Packages with enlarged through-vias in encapsulant2025
Package structure2025
Apparatus, system and method2025
3D integrated circuit (3DIC) structure2025