Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

US Patent 10211158 · Granted Feb 19, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor module with external power sensor2025
Double-sided coolable semiconductor package2025
Semiconductor device2024
Power module with metal substrate2024
Power semiconductor module arrangement2024
Method for producing a semiconductor arrangement2024
Fluid-cooled package having shielding layer2024
Semiconductor device2023
Method for producing a substrate2023
Semiconductor arrangement and method for producing the same2023
Power semiconductor module and method for fabricating the same2023
Power semiconductor module and method for fabricating the same2023