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Home › Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof

Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof

US Patent 10109531 · Granted Oct 23, 2018

Estimated economic value: $366,000 ⓘ

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