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Yu-Chih Su — 8 Patents

UMUnited Microelectronics: 7 patents #808 of 4,560Top 20%
KUKaohsiung Medical University: 1 patents #120 of 238Top 55%
Tainan, TW: #796 of 4,566 inventorsTop 20%
Overall (All Time): #600,572 of 4,157,543Top 15%
8 Patents All Time
Yu-Chih Su has been granted 8 US patents while listed as an inventor at United Microelectronics. The first was granted in 2018 and the most recent in March 2021. Yu-Chih Su ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Yu-Chih Su in Tainan, TW.

Patents per Year

Patents granted per year, 2018 to 2021Bar chart with a peak of 4 patents in 2019.peak 42018: 2 patents20182019: 4 patents20192020: 1 patents20202021: 1 patents2021

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10957762 Manufacturing method of semiconductor device including conductive structure Te-Chang Hsu, Che-Hsien Lin, Cheng-Yeh Huang, Chun-Jen Huang, Yao-Jhan Wang 2021-03-23 $1,964,000
10700163 Semiconductor device including conductive structure and manufacturing method thereof Te-Chang Hsu, Che-Hsien Lin, Cheng-Yeh Huang, Chun-Jen Huang, Yao-Jhan Wang 2020-06-30 $249,000
10446682 Method of forming semiconductor device Chi-Hsuan Cheng, Cheng-Pu Chiu, Chih-Yi Wang, Chin-Yang Hsieh, Tien-Shan Hsu +1 more 2019-10-15 $144,000
10283415 Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereof Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Cheng-Pu Chiu, Tien-Shan Hsu +2 more 2019-05-07 $221,000
10217866 Semiconductor device and method of forming the same Chi-Hsuan Cheng, Cheng-Pu Chiu, Chih-Yi Wang, Chin-Yang Hsieh, Tien-Shan Hsu +1 more 2019-02-26 $253,000
10211107 Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean step Chih-Yi Wang, Tien-Shan Hsu, Chi-Hsuan Cheng, Cheng-Pu Chiu, Te-Chang Hsu +4 more 2019-02-19 $335,000
10109531 Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Cheng-Pu Chiu, Tien-Shan Hsu +2 more 2018-10-23 $366,000
9856285 Reagents for universal site-specific labeling and modifications of nucleic acids Tzu-Pin Wang 2018-01-02

Frequent Collaborators

Yao-Jhan Wang5 shared
Te-Chang Hsu5 shared
Cheng-Pu Chiu5 shared
Chih-Yi Wang5 shared
Tien-Shan Hsu5 shared
Chi-Hsuan Cheng5 shared

Nearby-Ranked Inventors

Suryatej Gundavelli8
Hajime Yoshizawa8
Takahisa TATEKAWA8
Hye-Jin GONG8
Yang Ji8
Koichi Sekimizu8
Sandeep Rekhi8
Tejas Pradip Rode8
Jonatan Hörder8