Tien-Shan Hsu — 8 Patents at United Microelectronics

Tien-Shan Hsu has been granted 8 US patents while listed as an inventor at United Microelectronics. The first was granted in 2018 and the most recent in January 2023. Tien-Shan Hsu ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Tien-Shan Hsu in Tainan, TW.

Patents per Year

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11569235	Semiconductor device and method of manufacturing the same	Chih-Yi Wang, Cheng-Pu Chiu, Yao-Jhan Wang	2023-01-31	$1,536,000
10868011	Semiconductor device and method of manufacturing the same	Chih-Yi Wang, Cheng-Pu Chiu, Yao-Jhan Wang	2020-12-15	$2,611,000
10686079	Fin field effect transistor structure with particular gate appearance	Chih-Yi Wang, Cheng-Pu Chiu, Huang-Ren Wei, Chi-Sheng Tseng, Yao-Jhan Wang	2020-06-16	$391,000
10446682	Method of forming semiconductor device	Chi-Hsuan Cheng, Cheng-Pu Chiu, Yu-Chih Su, Chih-Yi Wang, Chin-Yang Hsieh +1 more	2019-10-15	$144,000
10283415	Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereof	Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu +2 more	2019-05-07	$221,000
10217866	Semiconductor device and method of forming the same	Chi-Hsuan Cheng, Cheng-Pu Chiu, Yu-Chih Su, Chih-Yi Wang, Chin-Yang Hsieh +1 more	2019-02-26	$253,000
10211107	Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean step	Chih-Yi Wang, Yu-Chih Su, Chi-Hsuan Cheng, Cheng-Pu Chiu, Te-Chang Hsu +4 more	2019-02-19	$335,000
10109531	Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof	Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu +2 more	2018-10-23	$366,000