CC

Chi-Hsuan Cheng

UM United Microelectronics: 7 patents #808 of 4,560Top 20%
NU National Taiwan University: 3 patents #238 of 2,195Top 15%
Overall (All Time): #476,880 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12414481 Semiconductor device and method for fabricating the same Jia-Rong Wu, Rai-Min Huang, Po-Kai Hsu 2025-09-09
12206148 Filter device and equivalent filter circuit thereof Tzong-Lin Wu, Hsu-Wei Liu, Po-Jui Li 2025-01-21
11043596 Semiconductor device and fabrication method thereof Shih-Wei Su, Hao-Hsuan Chang, Chih-Wei Chang, Ting-An Chien, Bin-Siang Tsai 2021-06-22
10446682 Method of forming semiconductor device Cheng-Pu Chiu, Yu-Chih Su, Chih-Yi Wang, Chin-Yang Hsieh, Tien-Shan Hsu +1 more 2019-10-15
10396419 Common-mode signal absorber Tzong-Lin Wu, Po-Jui Li, Ying-Cheng Tseng 2019-08-27
10283415 Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereof Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu +2 more 2019-05-07
10217866 Semiconductor device and method of forming the same Cheng-Pu Chiu, Yu-Chih Su, Chih-Yi Wang, Chin-Yang Hsieh, Tien-Shan Hsu +1 more 2019-02-26
10211107 Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean step Chih-Yi Wang, Tien-Shan Hsu, Yu-Chih Su, Cheng-Pu Chiu, Te-Chang Hsu +4 more 2019-02-19
10211496 Common-mode signal absorber and equivalent circuit thereof Tzong-Lin Wu, Po-Jui Li, Ying-Cheng Tseng 2019-02-19
10109531 Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereof Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu +2 more 2018-10-23