Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6285562 | Method of contacting a chip | Joachim Eldring | 2001-09-04 |
| 6281577 | Chips arranged in plurality of planes and electrically connected to one another | Hans-Hermann Oppermann, Ghassem Azdasht, Paul Kasulke | 2001-08-28 |
| 6277660 | Method and apparatus for testing chips | Frank Ansorge, Paul Kasulke, Andreas Ostmann, Rolf Aschenbrenner, Lothar Dietrich | 2001-08-21 |
| 6211571 | Method and apparatus for testing chips | Frank Ansorge, Paul Kasulke, Andreas Ostmann, Rolf Aschenbrenner, Lothar Dietrich | 2001-04-03 |
| 6160218 | Chip housing | Ghassem Azdasht, Herbert Reichl | 2000-12-12 |
| 6153940 | Core metal soldering knob flip-chip technology | Jens Nave, Joachim Eldring | 2000-11-28 |
| 6107118 | Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way | Rolf Aschenbrenner, Hans-Hermann Oppermann, Ghassem Azdasht | 2000-08-22 |
| 6093971 | Chip module with conductor paths on the chip bonding side of a chip carrier | Hans-Hermann Oppermann, Ghassem Azdasht, Paul Kasulke | 2000-07-25 |
| 6070788 | Method of soldering terminal faces, as well as a method of manufacturing a solder alloy | — | 2000-06-06 |
| 6043985 | Thermal connecting structure for connecting materials with different expansion coefficients | Ghassem Azdasht, Paul Kasulke, Habib Badrihafifekr, Stefan Weiss | 2000-03-28 |
| 6012625 | Process and device for forming raised metallised contacts | Jens Nave, Joachim Eldring | 2000-01-11 |
| 5989993 | Method for galvanic forming of bonding pads | Rolf Aschenbrenner, Andreas Ostmann, Paul Kasulke | 1999-11-23 |
| 5976302 | Method of joining electronic components to a substrate | Hans-Hermann Oppermann, Christine Kallmayer, Achim Kloeser | 1999-11-02 |
| 5956232 | Chip support arrangement and chip support for the manufacture of a chip casing | David Gu Lin, Jorg Gwiasda, Andreas Ostmann | 1999-09-21 |
| 5928458 | Flip chip bonding with non conductive adhesive | Rolf Aschenbrenner, Jorg Gwiasda, Joachim Eldring | 1999-07-27 |
| 5906312 | Solder bump for flip chip assembly and method of its fabrication | Rolf Aschenbrenner | 1999-05-25 |
| 5845838 | Process for remelting a contact surface metallization | Jorg Gwiasda, Hans-Hermann Oppermann, Achim Kloeser, Stefan Weiss | 1998-12-08 |
| 5833128 | Flux-free contacting of components | Joachim Kloeser, Herbert Reichl | 1998-11-10 |
| 5785234 | Method of surface-contacting electronic components | Stefan Weiss | 1998-07-28 |
| 4973389 | Process for making a high temperature-resistant metal layer on a ceramic surface | Klaus Majentny, Hermann Middeke | 1990-11-27 |