Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D683444 | Inhaler | Tadashi Koike, So Noguchi, Shuji Tsuruta, Shinya Tanaka | 2013-05-28 |
| D683445 | Inhaler | — | 2013-05-28 |
| D665073 | Atomizer for inhaler | Yoshikazu Inami | 2012-08-07 |
| D657044 | Inhaler | Yoshikazu Inami | 2012-04-03 |
| 7413130 | Paper tag identified by using radiofrequency and method of manufacturing the same | Naoya Kanda, Hiroshi Honma | 2008-08-19 |
| 7190072 | RFID-chip having RFID-tag or magnifying electrode | Naoya Kanda, Madoka Minagawa, Hiroshi Homma | 2007-03-13 |
| 7185823 | Paper tag identified by using radiofrequency and method of manufacturing the same | Naoya Kanda, Hiroshi Honma | 2007-03-06 |
| 7122087 | Method of manufacturing RFID | Naoya Kanda, Madoka Minagawa, Shigeharu Tsunoda | 2006-10-17 |
| 7057283 | Semiconductor device and method for producing the same | Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2006-06-06 |
| 6930388 | Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure | Yoshihide Yamaguchi, Hiroyuki Tenmei, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2005-08-16 |
| 6869008 | Method of forming bumps | Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima +1 more | 2005-03-22 |
| 6822317 | Semiconductor apparatus including insulating layer having a protrusive portion | Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-11-23 |
| 6770547 | Method for producing a semiconductor device | Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-08-03 |
| 6695200 | Method of producing electronic part with bumps and method of producing electronic part | Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku | 2004-02-24 |
| 6624504 | Semiconductor device and method for manufacturing the same | Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2003-09-23 |
| 6595404 | Method of producing electronic part with bumps and method of producing electronic part | Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku | 2003-07-22 |
| 6471115 | Process for manufacturing electronic circuit devices | Masahito Ijuin, Toru Nishikawa, Ryohei Sato, Mitsugu Shirai, Yuzo Taniguchi +2 more | 2002-10-29 |
| 6460755 | Bump forming method and apparatus therefor | Takamichi Suzuki, Hitoshi Odashima, Katsuhiro Iwashita, Tatsuya Yoneda, Michiharu Honda +8 more | 2002-10-08 |
| 6413850 | Method of forming bumps | Noriyuki Ooroku, Takamichi Suzuki, Asao Nishimura | 2002-07-02 |
| 6402014 | Method of forming bumps | Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima +1 more | 2002-06-11 |
| 6400020 | Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers | Tatsuya Yoneda, Takamichi Suzuki, Ryosuke Kimoto, Junichi Suzuki | 2002-06-04 |
| 6213386 | Method of forming bumps | Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima +1 more | 2001-04-10 |
| 6146920 | Bump formation method | Tatsuya Yoneda, Takamichi Suzuki, Ryosuke Kimoto, Junichi Suzuki | 2000-11-14 |