Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6795105 | Laser printing method and apparatus | Kaoru Katayama, Kenichi Inoue, Tsutomu Sakamoto | 2004-09-21 |
| 6705505 | Paste providing method, soldering method and apparatus and system therefor | Fumio Yoshikawa, Hideyuki Fukasawa, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura | 2004-03-16 |
| 6551449 | Thin electronic circuit component and method and apparatus for producing the same | Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki +1 more | 2003-04-22 |
| 6533162 | Paste providing method, soldering method and apparatus and system therefor | Fumio Yoshikawa, Hideyuki Fukasawa, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura | 2003-03-18 |
| 6471115 | Process for manufacturing electronic circuit devices | Masahito Ijuin, Toru Nishikawa, Ryohei Sato, Yuzo Taniguchi, Kosuke Inoue +2 more | 2002-10-29 |
| 6433810 | Laser printing method and apparatus for printing characters | Kaoru Katayama, Kenichi Inoue, Tsutomu Sakamoto | 2002-08-13 |
| 6410881 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata +1 more | 2002-06-25 |
| 6269998 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata +1 more | 2001-08-07 |
| 6203655 | Thin electronic circuit component and method and apparatus for producing the same | Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki +1 more | 2001-03-20 |
| 6193144 | Paste providing method, soldering method and apparatus and system therefor | Fumio Yoshikawa, Hideyuki Fukasawa, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura | 2001-02-27 |
| 6161748 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata +1 more | 2000-12-19 |
| 6137687 | Printed circuit board, IC card, and manufacturing method thereof | Shinichi Kazui, Hideaki Sasaki, Keiji Fujikawa, Makoto Matsuoka | 2000-10-24 |
| 6133135 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata +1 more | 2000-10-17 |
| 5973406 | Electronic device bonding method and electronic circuit apparatus | Masahide Harada, Toru Nishikawa, Ryohei Satoh, Osamu Yamada, Takayuki Uda | 1999-10-26 |
| 5940728 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata +1 more | 1999-08-17 |
| 5551148 | Method for forming conductive bumps | Shinichi Kazui, Makoto Matsuoka, Hideyuki Fukasawa, Mitsunori Tamura, Hideaki Sasaki | 1996-09-03 |
| 5516031 | Soldering method and apparatus for use in connecting electronic circuit devices | Toru Nishikawa, Masahito Ijuin, Ryohei Sato | 1996-05-14 |
| 5329160 | Semiconductor package with metalized portions | Shinya Miura, Kouzou Kanda | 1994-07-12 |