Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978497 | Wound magnetic core and method of producing the same | Daichi Azuma, Naoki Itoh, Makoto Sasaki | 2018-05-22 |
| 9290831 | Soft-magnetic, amorphous alloy ribbon and its production method, and magnetic core constituted thereby | Yoshihito Yoshizawa, Naoki Ito, Makoto Sasaki | 2016-03-22 |
| 7614541 | Method and apparatus for placing conductive balls | Motoyuki Itoh, Masanori Ochiai | 2009-11-10 |
| 7431792 | Method and apparatus for placing conductive balls | Motoyuki Itoh, Masanori Ochiai | 2008-10-07 |
| 6677553 | Laser processing apparatus | Takashi Matsumoto, Masayuki Kawaharata, Madoka Tanouchi, Masatake Muranaga | 2004-01-13 |
| 6551449 | Thin electronic circuit component and method and apparatus for producing the same | Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Hideaki Sasaki, Hitoshi Odashima +1 more | 2003-04-22 |
| 6498319 | Method and an apparatus for manufacturing multi-layer boards using laser light | Takashi Matsumoto, Masayuki Kawaharata, Madoka Tanouchi, Masatake Muranaga | 2002-12-24 |
| 6423405 | Surface reformation method of high polymer material | Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Hideaki Sasaki, Yasuhiro Iwata | 2002-07-23 |
| 6410881 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai +1 more | 2002-06-25 |
| 6406357 | Grinding method, semiconductor device and method of manufacturing semiconductor device | Kazuo Shirase, Kenji Morita, Hideaki Sasaki, Hitoshi Odashima | 2002-06-18 |
| 6340109 | Solder bump measuring method and apparatus | Yutaka Hashimoto, Hideaki Sasaki, Mamoru Kobayashi | 2002-01-22 |
| 6269998 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai +1 more | 2001-08-07 |
| 6203655 | Thin electronic circuit component and method and apparatus for producing the same | Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Hideaki Sasaki, Hitoshi Odashima +1 more | 2001-03-20 |
| 6196441 | Solder bump measuring method and apparatus | Yutaka Hashimoto, Hideaki Sasaki, Mamoru Kobayashi | 2001-03-06 |
| 6161748 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai +1 more | 2000-12-19 |
| 6137687 | Printed circuit board, IC card, and manufacturing method thereof | Mitsugu Shirai, Hideaki Sasaki, Keiji Fujikawa, Makoto Matsuoka | 2000-10-24 |
| 6133135 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai +1 more | 2000-10-17 |
| 6069701 | Method and apparatus for measuring the height of an object | Yutaka Hashimoto, Hideaki Sasaki | 2000-05-30 |
| 6017424 | Laser assisted surface reformation method of high polymer material | Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Hideaki Sasaki, Yasuhiro Iwata | 2000-01-25 |
| 5968382 | Laser cleavage cutting method and system | Takashi Matsumoto, Hideaki Sasaki, Tateoki Miyauchi, Tatsuji Sakamoto | 1999-10-19 |
| 5940728 | Process for manufacturing electronic circuits | Kaoru Katayama, Hiroshi Fukuda, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai +1 more | 1999-08-17 |
| 5906309 | Solder bump measuring method and apparatus | Yutaka Hashimoto, Hideaki Sasaki, Mamoru Kobayashi | 1999-05-25 |
| 5832595 | Method of modifying conductive lines of an electronic circuit board and its apparatus | Shigenobu Maruyama, Mikio Hongo, Haruhisa Sakamoto, Tateoki Miyauchi, Ryohei Satoh +3 more | 1998-11-10 |
| 5801350 | Surface reformation method of high polymer material | Tsutomu Shibuya, Kaoru Katayama, Mitugu Shirai, Hideaki Sasaki, Yasuhiro Iwata | 1998-09-01 |
| 5551148 | Method for forming conductive bumps | Makoto Matsuoka, Hideyuki Fukasawa, Mitsunori Tamura, Mitsugu Shirai, Hideaki Sasaki | 1996-09-03 |