Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7265035 | Semiconductor device and its manufacturing method | Hiroshi Honma, Noriyuki Ooroku, Toru Mita, Chuichi Miyazaki, Takashi Wada | 2007-09-04 |
| 6629553 | Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card | Kazuyuki Futagi, Makoto Matsuoka, Toshimitsu Nakagawa | 2003-10-07 |
| 6602736 | Method and apparatus for separating semiconductor chips | Makoto Matsuoka, Kazuyuki Futagi, Syoji Nakakuki | 2003-08-05 |
| 6551449 | Thin electronic circuit component and method and apparatus for producing the same | Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki +1 more | 2003-04-22 |
| 6460755 | Bump forming method and apparatus therefor | Kosuke Inoue, Takamichi Suzuki, Katsuhiro Iwashita, Tatsuya Yoneda, Michiharu Honda +8 more | 2002-10-08 |
| 6406357 | Grinding method, semiconductor device and method of manufacturing semiconductor device | Shinichi Kazui, Kazuo Shirase, Kenji Morita, Hideaki Sasaki | 2002-06-18 |
| 6203655 | Thin electronic circuit component and method and apparatus for producing the same | Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki +1 more | 2001-03-20 |
| 5279045 | Minute particle loading method and apparatus | Hiroshi Hasegawa, Masayuki Kawaharata, Hideyuki Fukasawa | 1994-01-18 |
| 4882833 | Method and apparatus for mounting coils inside a hollow cylindrical article | Hiromichi Hiramatsu, Kuniaki Hirayama, Toshio Ohji | 1989-11-28 |
| 4620663 | Parts-connecting apparatus using solder | Hideaki Sasaki, Shinichi Kazui, Shigeo Shiono, Osamu Isshiki, Takeshi Kawana | 1986-11-04 |