Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6705505 | Paste providing method, soldering method and apparatus and system therefor | Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura | 2004-03-16 |
| 6533162 | Paste providing method, soldering method and apparatus and system therefor | Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura | 2003-03-18 |
| 6193144 | Paste providing method, soldering method and apparatus and system therefor | Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura | 2001-02-27 |