TS

Thomas R. Sarubbi

OM Ocg Microelectronic Materials: 10 patents #6 of 42Top 15%
OP Olin Hunt Specialty Products: 4 patents #5 of 39Top 15%
FU Fujifilm Electronic Materials U.S.A.: 1 patents #57 of 77Top 75%
Overall (All Time): #326,584 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7416821 Thermally cured undercoat for lithographic application Binod B. De, Sanjay Malik, J. Thomas Kocab 2008-08-26
5494785 High ortho-ortho bonded novolak binder resins and their use in a process for forming positive resist patterns Joseph J. Sizensky, Medhat A. Toukhy 1996-02-27
5473045 High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions Joseph J. Sizensky, Medhat A. Toukhy 1995-12-05
5413894 High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions Joseph J. Sizensky, Medhat A. Toukhy 1995-05-09
5350827 Selected structurally defined novolak binder resins and their use in radiation-sensitive compositions Joseph J. Sizensky 1994-09-27
5338652 Selected structurally defined novolak binder resins and their use in photoresist pattern formation Joseph J. Sizensky 1994-08-16
5306594 Radiation-sensitive compositions using novolak resins made from a substituted bis(hydroxyphenyl)methane and a bis-(methylol)-cresol Joseph J. Sizensky 1994-04-26
5151339 Photoresist composition containing diazoquinone photosensitizer and novalak resin characterized by the complete and selective removal of dimeric species from the novolak resin 1992-09-29
5132376 Process for selective removal of dimeric species from phenolic polymers 1992-07-21
5053479 Thermally stable phenolic resin compositions and their use in light-sensitive compositions Andrew J. Blakeney, Joseph J. Sizensky 1991-10-01
5024921 Thermally stable light-sensitive compositions with o-quinone diazide and phenolic resin used in a method of forming a positive photoresist image Andrew J. Blakeney, Alfred T. Jeffries, III 1991-06-18
5001040 Process of forming resist image in positive photoresist with thermally stable phenolic resin Andrew J. Blakeney, Joseph J. Sizensky 1991-03-19
4970287 Thermally stable phenolic resin compositions with ortho, ortho methylene linkage Andrew J. Blakeney, Alfred T. Jeffries, III 1990-11-13
4959292 Light-sensitive o-quinone diazide composition and product with phenolic novolak prepared by condensation with haloacetoaldehyde Andrew J. Blakeney, Joseph J. Sizensky 1990-09-25
4837121 Thermally stable light-sensitive compositions with o-quinone diazide and phenolic resin Andrew J. Blakeney, Alfred T. Jeffries, III 1989-06-06