Issued Patents All Time
Showing 25 most recent of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11196184 | Broadband antenna array | Jared W. Jordan, Kenneth Vanhille, Timothy Amis Smith, William Stacy, Benjamin L. Cannon | 2021-12-07 |
| 10497511 | Multilayer build processes and devices thereof | — | 2019-12-03 |
| 10431521 | Integrated electronic components and methods of formation thereof | Jean-Marc Rollin | 2019-10-01 |
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-07-23 |
| 10305158 | Three-dimensional microstructures | Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner | 2019-05-28 |
| 10257951 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, J. Robert Reid, Will Stacy, Ken Vanhille | 2019-04-09 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-01-29 |
| 10135109 | Method of forming a coaxial line microstructure having an enlarged region on a substrate and removing the coaxial line microstructure from the substrate for mounting on a mounting substrate | — | 2018-11-20 |
| 10074885 | Coaxial waveguide microstructures having conductors formed by plural conductive layers | John J. Fisher | 2018-09-11 |
| 10076042 | Devices and methods for solder flow control in three-dimensional microstructures | James Reid | 2018-09-11 |
| 10002818 | Integrated electronic components and methods of formation thereof | Jean-Marc Rollin | 2018-06-19 |
| 9993982 | Methods of fabricating electronic and mechanical structures | Dara L. Cardwell | 2018-06-12 |
| 9888600 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, J. Robert Reid, Will Stacy, Ken Vanhille | 2018-02-06 |
| 9843084 | Three-dimensional microstructures | Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner | 2017-12-12 |
| 9817199 | Device package and methods for the fabrication and testing thereof | — | 2017-11-14 |
| 9647420 | Package and methods for the fabrication and testing thereof | — | 2017-05-09 |
| 9583856 | Batch fabricated microconnectors | Jean-Marc Rollin | 2017-02-28 |
| 9570789 | Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof | — | 2017-02-14 |
| 9570787 | Hollow core coaxial cables and methods of making the same | Noel Heiks | 2017-02-14 |
| 9515364 | Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume | William D. HOUCK | 2016-12-06 |
| 9505613 | Devices and methods for solder flow control in three-dimensional microstructures | James Reid | 2016-11-29 |
| 9490517 | High frequency power combiner/divider | Donald X. Wu, Jean-Marc Rollin | 2016-11-08 |
| 9413052 | Three-dimensional microstructures | Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner | 2016-08-09 |
| 9410799 | Device package and methods for the fabrication and testing thereof | — | 2016-08-09 |
| 9337152 | Formulation for packaging an electronic device and assemblies made therefrom | James D. MacDonald, Jr. | 2016-05-10 |