Issued Patents All Time
Showing 26–50 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312589 | Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section | John J. Fisher | 2016-04-12 |
| 9306254 | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration | Ian Hovey, J. Robert Reid, Will Stacy, Ken Vanhille | 2016-04-05 |
| 9306255 | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other | Jean-Marc Rollin, J. Robert Reid, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2016-04-05 |
| 9136575 | Three-dimensional microstructures | Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner | 2015-09-15 |
| 9088074 | Hollow core coaxial cables and methods of making the same | Noel Heiks | 2015-07-21 |
| 9065163 | High frequency power combiner/divider | Donald X. Wu, Jean-Marc Rollin | 2015-06-23 |
| 9024417 | Integrated electronic components and methods of formation thereof | Jean-Marc Rollin | 2015-05-05 |
| 9000863 | Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof | — | 2015-04-07 |
| 8993450 | Device package and methods for the fabrication and testing thereof | — | 2015-03-31 |
| 8969132 | Device package and methods for the fabrication thereof | James D. MacDonald, Jr. | 2015-03-03 |
| 8933769 | Three-dimensional microstructures having a re-entrant shape aperture and methods of formation | William D. HOUCK | 2015-01-13 |
| 8917150 | Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels | Kenneth Vanhille | 2014-12-23 |
| 8866300 | Devices and methods for solder flow control in three-dimensional microstructures | James Reid | 2014-10-21 |
| 8814601 | Batch fabricated microconnectors | Jean-Marc Rollin | 2014-08-26 |
| 8742874 | Coaxial waveguide microstructures having an active device and methods of formation thereof | John J. Fisher | 2014-06-03 |
| 8717124 | Thermal management | Kenneth Vanhille | 2014-05-06 |
| 8703603 | Device package and methods for the fabrication and testing thereof | Larry J. Rasnake, John J. Fisher | 2014-04-22 |
| 8698577 | Three-dimensional microstructures | Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steve E. Huettner | 2014-04-15 |
| 8659371 | Three-dimensional matrix structure for defining a coaxial transmission line channel | Daniel L. Fonataine | 2014-02-25 |
| 8542079 | Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector | Jean-Marc Rollin | 2013-09-24 |
| 8399897 | Optical device package | Mindaugas F. Dautartas, Neil Ricks, Dan Steinberg | 2013-03-19 |
| 8309908 | Optoelectronic component including optoelectronic device flip-chip mounted to substrate and conductor extending through the substrate | Noel Heiks | 2012-11-13 |
| 8203207 | Electronic device packages and methods of formation | James W. Getz, John J. Fisher | 2012-06-19 |
| 8049161 | Optoelectronic component with flip-chip mounted optoelectronic device | Noel Heiks | 2011-11-01 |
| 8031037 | Three-dimensional microstructures and methods of formation thereof | William D. HOUCK | 2011-10-04 |