Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Will Stacy, Ken Vanhille +1 more | 2019-07-23 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Will Stacy, Ken Vanhille +1 more | 2019-01-29 |
| 9306255 | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Will Stacy, Ken Vanhille +1 more | 2016-04-05 |