Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553511 | Integrated chip scale packages | — | 2020-02-04 |
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, David W. Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-07-23 |
| 10319654 | Integrated chip scale packages | — | 2019-06-11 |
| 10257951 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, David W. Sherrer, Will Stacy, Ken Vanhille | 2019-04-09 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, David W. Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-01-29 |
| 9888600 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, David W. Sherrer, Will Stacy, Ken Vanhille | 2018-02-06 |
| 9660614 | Stacked, switched filter banks | — | 2017-05-23 |
| 9306254 | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration | Ian Hovey, David W. Sherrer, Will Stacy, Ken Vanhille | 2016-04-05 |
| 9306255 | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other | Jean-Marc Rollin, David W. Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2016-04-05 |
| 8230564 | Method of making a millimeter wave transmission line filter | — | 2012-07-31 |