Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Ken Vanhille, J. Marcus Oliver +1 more | 2019-07-23 |
| 10257951 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, J. Robert Reid, David W. Sherrer, Ken Vanhille | 2019-04-09 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Ken Vanhille, J. Marcus Oliver +1 more | 2019-01-29 |
| 9888600 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, J. Robert Reid, David W. Sherrer, Ken Vanhille | 2018-02-06 |
| 9306254 | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration | Ian Hovey, J. Robert Reid, David W. Sherrer, Ken Vanhille | 2016-04-05 |
| 9306255 | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Ken Vanhille, J. Marcus Oliver +1 more | 2016-04-05 |