| 10361471 |
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems |
Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Ken Vanhille, J. Marcus Oliver +1 more |
2019-07-23 |
| 10257951 |
Substrate-free interconnected electronic mechanical structural systems |
Ian Hovey, J. Robert Reid, David W. Sherrer, Ken Vanhille |
2019-04-09 |
| 10193203 |
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems |
Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Ken Vanhille, J. Marcus Oliver +1 more |
2019-01-29 |
| 9888600 |
Substrate-free interconnected electronic mechanical structural systems |
Ian Hovey, J. Robert Reid, David W. Sherrer, Ken Vanhille |
2018-02-06 |
| 9306254 |
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration |
Ian Hovey, J. Robert Reid, David W. Sherrer, Ken Vanhille |
2016-04-05 |
| 9306255 |
Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other |
Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Ken Vanhille, J. Marcus Oliver +1 more |
2016-04-05 |