Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7365441 | Semiconductor device fabricating apparatus and semiconductor device fabricating method | Chikao Ikenaga, You Shimazaki, Masachika Masuda, Takuji Okeyui, Keisuke Yoshikawa +1 more | 2008-04-29 |
| 7262514 | Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device | Keisuke Yoshikawa, Takuji Okeyui, Kazuhiro Ikemura | 2007-08-28 |
| 7235888 | Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device | Takuji Okeyui, Hirofumi Fujii, Yasuhiko Yamamoto | 2007-06-26 |
| 7232709 | Process for producing a semiconductor device | Sadahito Misumi, Takeshi Matsumura, Hiroyuki Kondou | 2007-06-19 |
| 7132755 | Adhesive film for manufacturing semiconductor device | Takuji Okeyui, Kazuhiro Ikemura, Keisuke Yoshikawa | 2006-11-07 |
| 7115989 | Adhesive sheet for producing a semiconductor device | — | 2006-10-03 |
| 7064011 | Semiconductor device fabricating apparatus and semiconductor device fabricating method | Chikao Ikenaga, You Shimazaki, Masachika Masuda, Takuji Okeyui, Keisuke Yoshikawa +1 more | 2006-06-20 |
| 6858473 | Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device | Takuji Okeyui, Hirofumi Fujii, Yasuhik Yamamoto | 2005-02-22 |
| 6312799 | Pressure-sensitive acrylic adhesive composition for adhesion of polyester film and adhesive sheets thereof | Masahiro Ohura | 2001-11-06 |
| 6261685 | Thermosetting adhesive and adhesive sheet thereof | Masahiro Oura | 2001-07-17 |
| 6211261 | Thermosetting pressure-sensitive adhesive and adhesive sheet thereof | Masahiro Oura | 2001-04-03 |
| 6130269 | Pressure-sensitive adhesive of (meth)acrylate, unsaturated acid, poly(meth)acrylate and epoxy resin | Shigeki Muta, Hitoshi Takahira, Takao Yoshikawa | 2000-10-10 |