Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145446 | Grain-oriented electrical steel sheet | Shinsuke Takatani, Shunsuke Okumura, Shohji Nagano | 2021-10-12 |
| 11083269 | Wig foundation net | Teruyuki Tokunaga, Kaori Yuhi | 2021-08-10 |
| 10907234 | Grain-oriented electrical steel sheet and decarburized steel sheet used for manufacturing the same | Hiroshi Fujimura, Fumiaki Takahashi | 2021-02-02 |
| 10816067 | Integrated ball screw linear actuator | John Feitl, Koichi Morita | 2020-10-27 |
| 9954416 | Actuator, stator, motor, rotational-to-linear motion conversion mechanism, and linear actuator | Yusuke Ota, Toshifumi Taguchi, Hayao Watanabe | 2018-04-24 |
| 9120072 | Ammonia detoxification device | Tsutomu Tsukada, Hiroshi Imamura, Hiroki KUZUOKA, Hiroaki Kaneshiro, Isamu Nagai | 2015-09-01 |
| 8674384 | Light emitting element | Yukie Nishikawa, Hironori Yamasaki | 2014-03-18 |
| 8618551 | Semiconductor light emitting device | Yukie Nishikawa, Hironori Yamasaki, Katsuyoshi Furuki | 2013-12-31 |
| 8591688 | Functional film and method for producing the same | Eijirou Iwase, TOYOAKI HIEDA | 2013-11-26 |
| 8530913 | Light emitting device | Yukie Nishikawa, Hironori Yamasaki, Hisashi Mori, Kazunari Yabe | 2013-09-10 |
| 8268079 | Vacuum film deposition apparatus | Yukinori Nakamura, Makoto Kashiwaya, Hiroshi Sohda | 2012-09-18 |
| 8039373 | Pattern film forming method and pattern film forming apparatus | Jun Fujinawa, Junji Nakada, Norio Shibata | 2011-10-18 |
| 7462927 | Pattern film forming method and pattern film forming apparatus | Jun Fujinawa, Junji Nakada, Norio Shibata | 2008-12-09 |
| 7408977 | Wireless communications apparatus and method using array antenna | Kenichi Higuchi, Hidekazu Taoka, Mamoru Sawahashi | 2008-08-05 |
| 6969557 | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same | Mitsuyoshi Matsuda | 2005-11-29 |
| 6902824 | Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same | Takuya Yamamoto, Yutaka Hirasawa, Naotomi Takahashi | 2005-06-07 |
| 6827867 | Method for manufacturing printed wiring board | Takuya Yamamoto, Yutaka Hirasawa | 2004-12-07 |
| 6716572 | Manufacturing process for printed wiring board | Takuya Yamamoto, Yutaka Hirasawa, Naotomi Takahashi | 2004-04-06 |
| 6660406 | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit | Takuya Yamamoto, Naotomi Takahashi | 2003-12-09 |
| 6585877 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-07-01 |
| 6579437 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-06-17 |
| 6548153 | Composite material used in making printed wiring boards | Yutaka Hirasawa, Takuya Yamamoto, Kenichiro Iwakiri, Tsutomu Higuchi | 2003-04-15 |
| 6544663 | Electrodeposited copper foil | Osamu Nakano, Sakiko Taenaka, Naohito Uchida, Noriko Hanzawa | 2003-04-08 |
| 6533915 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-03-18 |
| 6531045 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-03-11 |