Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7936567 | Wiring board with built-in component and method for manufacturing the same | Tsuneaki Takashima, Jun Otsuka, Makoto Origuchi, Yukinobu Nagao, Chy Narith | 2011-05-03 |
| 6976415 | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel | Tomoe Suzuki, Shinji Yuri, Kazuhisa Sato | 2005-12-20 |
| 6872436 | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel | Tomoe Suzuki, Shinji Yuri, Kazuhisa Sato | 2005-03-29 |
| 6674017 | Multilayer-wiring substrate and method for fabricating same | Osamu Hisada, Katsuhiko Hasegawa, Naoki Kito, Satoshi Hirano | 2004-01-06 |
| 6224703 | Method of making laminate ceramic substrate with domed pads | Hideshi Matsubara, Kazuo Kimura, Motohiko Itai | 2001-05-01 |
| 6148900 | Connecting board for connection between base plate and mounting board | Hajime Saiki | 2000-11-21 |
| 6139904 | Method of making a printed board | Osamu Hisada, Katsuhiko Hasegawa, Naoki Kito, Satoshi Hirano, Yutaro Kameyama | 2000-10-31 |
| 6115913 | Connecting board | Hajime Saiki | 2000-09-12 |
| 6080936 | Connecting board with oval-shaped protrusions | Hajime Saiki | 2000-06-27 |
| 6077728 | Method of producing a ceramic package main body | Naomiki Kato | 2000-06-20 |
| D423533 | Solder ball interposer | Hajime Saiki | 2000-04-25 |
| D423532 | Solder column interposer | Hajime Saiki | 2000-04-25 |
| D423027 | Solder ball interposer | Hajime Saiki | 2000-04-18 |
| 6018197 | Wired board with improved bonding pads | Hajime Saiki | 2000-01-25 |
| 5859407 | Connecting board for connection between base plate and mounting board | Hajime Saiki | 1999-01-12 |
| 5822851 | Method of producing a ceramic package main body | Naomiki Kato | 1998-10-20 |
| 5621190 | Ceramic package main body | Naomiki Kato | 1997-04-15 |
| 5545598 | High heat conductive body and wiring base substrate fitted with the same | Kouki Ogawa, Naomiki Kato | 1996-08-13 |
| 5099388 | Alumina multilayer wiring substrate provided with high dielectric material layer | Masahiro Ogawa, Mitsuru Hirano, Michael A. Schmitt, Bidyut K. Bhattacharyya | 1992-03-24 |
| 5060049 | Multiple resistivity wiring apparatus | Kouichi Mouri, Naomiki Kato, Mitsuru Hirano, Michael A. Schmitt, Bidyut K. Bhattacharyya | 1991-10-22 |